tesa HAF® 8473

80µm amber reactive structural bonding film

At room temperature tesa HAF® 8473 is not tacky.
Reliable and ageing-resistant bonds
Extremely high performance, even on small bonding areas and thin design gaps
Very low oozing ratio
Suitable for long-term applications that are exposed to heavy stress
tesa HAF® 8473 is free of halogen and compliant with current ROHS standards.

Product description

tesa HAF® 8473 is a reactive heat activated structural bonding film based on phenolic resin and nitrile rubber. This amber double sided tape has no backing. It is protected by a strong paper liner.

It is activated by heat and pressure applied during the assembly process.

Application Fields

tesa HAF® 8473 is especially recommended for bonding of metal components to metal surfaces or heat resistant plastics, e.g. SUS or AL to PI, PMMA or ABS:

Constructive bonding inside electronic devices
FPC bonding
Button fixation
Camera lens and bezel mounting
Bonding of decorative metal components

Product Construction

Type of adhesive	nitrile rubber / phenolic resin
Type of liner	glassine
Total thickness	80 µm
Backing material	none
Color	amber

Properties / Performance Values

Bonding strength

7 N/mm²

Additional Info

Technical recommendations:
tesa HAF® is not self adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for bond line parameters to start with.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the first substrate. This step does not affect the shelf life time of the adhesive tape. Pre-laminated components can be stored over the same period of time as the adhesive tape.
setting:

Temperature¹ 95-120 °C
Pressure² 2-6 bar
Time 3-10 s

2. Bonding:
Remove the liner from tape after pre-lamination step. Place the pre-laminated part onto the second substrate. Apply sufficient temperature while applying pressure for the bonding time to reach sufficient bonding strength.
setting:

Temperature¹ 120-250 °C
Pressure² 5-30 bar
Time 5-180 s

Temperature, pressure and time will depend upon the type and thickness of the substrates. Generally, thicker substrates or lower bonding temperatures will require longer bonding times. To achieve optimum performance a cooling step (while applying pressure) directly after the bonding step is recommended.
¹ ‘Pre-lamination’ and ‘Bonding’ temperature refer to the data that is measured in the bond line.
² ‘Pre-lamination’ and ‘Bonding’ pressure refer to the force that is transformed from jig surface directly to the bonding area.
Bonding strength values were obtained under standard laboratory conditions. (Material: etched aluminum test specimen / bonding conditions: temperature = 180 °C; pressure = 10 bar; time = 7 sec).
To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa HAF® shelf life concept.

tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.

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