Thermal Management Tapes
Solutions that keeps devices cool.
5G technology and the trend towards higher energy consumption generate more heat on components such as core chip modules and antenna applications in mobile devices. This increased temperature of components leads to a variety of effects such as performance and malfunction on the component itself and also on the performance of the entire device. End users may get a negative image of the device, such as low performance at slow data speeds, low reliability, or discomfort from high surface temperature of the device. These issues need to be addressed and our thermal management tapes can help.
Typical applications of our TMT assortment
tesa® TMT 6073x
Product design of tesa® TMT 6073x
Normal PSA solutions are limited in their thermal management. This is due to two factors:
- Poor wet-out properties lead to air inclusions during bonding process.
- Low thermal conductivity results from high thermal impedance.
Therefore, normal PSAs are not very efficient in heat dissipation in z-direction.
tesa® TMT 6073x addresses precisely these challenges. The adhesive used has excellent wet-out properties and is also supplemented with thermally conductive filler elements to ensure high thermal conductivity. A strong bonding strength enables the secure bonding of different components. Additionally the tape has an excellent electrical insulation.
Features
Surface wet-out
Thermal conductivity
High bonding
Thermal Management Tapes - Performance Overview
Product
Color
Thickness [μm]
Wetting [%]
Thermal conductivity
[W/m x K] ASTM D5470
Peel adhesion [N/cm] ASTM D3330
Dielectric strength [kV/mm] ASTM D-149
tesa® TMT 60731
White
30
89
0.6
4.3
33
tesa® TMT 60732
White
50
90
0.6
4.7
25
tesa® TMT 60733
White
100
92
0.7
5.0
20
Downloads
