An exploded view of a smartphone showing separated internal components—such as the casing, battery, camera modules, and circuit board—against a gray background. tesa tape is visible securing various parts within the assembly. (This text has been generated by AI)

Design beyond the bond

Introducing tesa's Debonding on Demand technology

In a circular economy, it’s not enough to build things to last. They also need to come apart cleanly, efficiently, on demand. tesa’s Debond on Demand technology enables smarter separation so you can design, repair and recycle without compromise.

A new era of circularity

Learn how four pioneering debonding mechanisms are redefining what's possible - powering a new era of adhesive technology.

Electrical release

Low-voltage electricity causes electrochemical reactions and allows debonding of the adhesive within a few seconds. 

Laser release

In just a few seconds, light from a Near Infrared (NIR) laser weakens the tape structure – causing it to debond.

Stretch release

Developed from the famous tesa® Powerstrips, tesa® Bond & Detach tapes feature a tab that users can pull to remove the tape by reducing the bonding strength via stretching.

Thermal release

Thermal release works by generating heat, either directly or through induction, which causes the adhesive to expand or break down and enables clean separation.

 

One breakthrough. Endless possibilities.

Designed to meet the real-world pressures of modern manufacturing, tesa’s Debond on Demand technology helps manufacturers build with the future in mind. It enables clean separation, material recovery and reuse, extending product lifetimes, reducing waste and supporting compliance with evolving repair and recycling targets.

From idea to implementation - partner with us!

Contact us now to learn how tesa's Debonding on Demand technology can help you design without constraint, repair without waste, and recycle without compromise. A tesa expert will be in touch shortly.
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