Structural Bonding Solutions
for increased device reliability
tesa® structural bonding solutions provide high structural bonding performance to a wide variety of substrates. They withstand the harshest conditions by combining outstanding chemical and aging resistance. The processing of these adhesive systems is simplified due to excellent die cuttability, immediate handling stability after activation, and low oozing.
Heat-activated films
tesa® HAF is a thermosetting adhesive system. An irreversible cross-linking reaction is initiated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds.
Low-temperature activated film
Our low-temperature reactive films tesa® LTR and tesa® LTC have been designed for activation at moderate temperatures. The cross-linking starts at a bond-line temperature above 75°C. tesa® LTT is a low temperature thermoplastic film designed for soft goods assembly requiring low processing temperatures.
Light-curing tapes
tesa® UV epoxy and tesa® L-tape are our latest developments that will cure at room temperature when exposed to light. They achieve significantly higher bonding strengths compared to PSAs. They come with high initial tack and immediate holding strength after bonding.
General features
Typical Applications of our Structural Bonding Solutions
Assortment overview
| tesa® HAF | tesa® LTR | tesa® LTC | tesa® LTT | tesa® UV epoxy | tesa® L-tape | |
|---|---|---|---|---|---|---|
| Color | Black, amber | Black, white, translucent | Black | Translucent | White | Translucent |
| Adhesive | Nitrile rubber/phenolic resin | Cross-linkable polyurethane | Cross-linkable polyurethane | Thermoplastic polyurethane | UV curable reactive epoxy | Light curable |
| Activation temperature [°C] | >120 | >75 | >75 | >80 | Room temperature | Room temperature |
| Special features | Temperature resistance,chemical resistance | Impact resistance,wettability on fabrics | Impact resistance,chemical resistance | High peel adhesion to fabrics | Activation at room temperature, reworkability | Activation at room temperature, impact resistance |
Thicknesses
| Thickness [μm] | tesa® HAF | tesa® LTR | tesa® LTC | tesa® LTT | tesa® UV epoxy | tesa® L-tape |
|---|---|---|---|---|---|---|
| 10 μm | ⚫ 58469 | |||||
| 20 μm | ⚫ 58477 | |||||
| 25 μm | ||||||
| 30 μm | ⚫ 58471 Ⓐ 8471 | ⚪ 8711 | ⦾ 8741 | |||
| 50 μm | ⚫ 58470 | ⚫ 58480 ⚪ 8710 ⦾ 8722 | ⚫ 58722 | ⦾ 87422 | ||
| 60 μm | Ⓐ 8472 | |||||
| 80 μm | ⚫ 58473 Ⓐ 8473 | |||||
| 100 μm | ⚫ 58474 Ⓐ 8474 | ⚫ 58484 ⚪ 8714 | ⚫ 58724 | ⚪ 8684 | ||
| 125 μm | ⚫ 58475 Ⓐ 8475 | |||||
| 150 μm | ⚫ 58476 Ⓐ 8476 | ⚫ 58486 | ||||
| 200 μm | ⚫ 58478 Ⓐ 8478 | ⚫ 58488 | ⦾ 8698 | |||
| 300 μm | ⚫ 58489 |
Product performance1
| Reference product | ⚫ 58474 | ⚫ 58484 | ⚫ 58724 | ⦾ 87422 | ⚪ 8684 | ⦾ 8694 |
|---|---|---|---|---|---|---|
| Reference substrate | SUS/SUS | PC/PC | AL/AL | PC/PC | PC/PC | AI/PC |
| Push-out [MPa] | >5.5 | >5.5 | >4.0 | >2.5 | >2.5 | >3.0 |
| DuPont [J; xy/z] | >0.5 | >4.0 | >1.0 | n.a. | >0.55 | >1.0 |
| Reliability1 | ⚫⚫⚫⚫ | ⚫⚫⚫ | ⚫⚫⚫⚫ | ⚫⚫ | ⚫⚫⚫ | ⚫⚫⚫ |
| Chemical resistance1 | ⚫⚫⚫⚫ | ⚫⚫ | ⚫⚫⚫ | ⚫ | ⚫⚫ | ⚫⚫ |
1 Assessment is done only in relation to other products of this assortment
2 Deviating thickness
Ⓐ Amber ⦾ Translucent ⚪ White ⚫ Black
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