Thin and narrow die-cuts, repulsion resistance and temperature resistance
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Structural Bonding Solutions
Structural Bonding Solutions
Increased device stability with our structural bonding solutions
Electronic devices are increasingly miniaturized and sophisticated. Complex designs require smaller bonding areas and higher tape performance. tesa® structural bonding solutions meet the most challenging demands of manufacturers and consumers over the life cycle of the devices. They provide high structural bonding performance to a wide variety of substrates with both fast and durable bonds. They withstand the harshest conditions by combining outstanding chemical and aging resistance with excellent sealing properties. The processing of these adhesive systems is simplified due to excellent die-cuttability, immediate handling stability after heat activation, and low oozing.
Typical applications of our structural bonding solutions
Heat-Activated Films
Our tesa HAF® and tesa® XPU series are thermosetting adhesive systems. An irreversible cross-linking reaction is initiated by heat and pressure starting at temperatures above 110°C.
tesa HAF® 5847x/847x
tesa HAF® is a heat-activated film based on phenolic resin and nitrile rubber. It is activated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds and outstanding reliability.
tesa® XPU 5870x/870x
tesa® Cross-Linkable Polyurethane (XPU) is activated by very low bonding pressure and temperatures from 110°C to 200°C. Our XPU series offer strong and reliable bonding strength – even on combinations of different substrates like plastics and metals.
tesa® LTR 5848x/871x/872x
tesa® LTR is especially recommended for the reliable bonding of temperature-sensitive substrates. The LTR 5848x and 871x series bond extremely well to plastics and leather, while LTR 872x is specifically designed for the bonding of fabrics.
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nitrile rubber / phenolic resin
30 µm
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