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Increased device stability with our structural bonding solutions: tesa HAF®.
Electronic devices are becoming more and more miniaturized and sophisticated. Complex designs require smaller bonding areas as well as higher tape performance. Our tesa HAF® tapes are successfully used in many of these applications and offer not only superior bonding strength and shock resistance but also durability and environmental resistance on a broad variety of substrates. Because of these features, our adhesive tapes meet all the requirements of structural bonding.