Electronics. Structural Bonding Application
Structural Bonding for Increased Device Stability

Structural Bonding for Increased Device Stability

Increased device stability with our structural bonding solutions: tesa HAF®.



Superior Bonding Strength Even on Small Bonding Areas

Electronic devices are becoming more and more miniaturized and sophisticated. Complex designs require smaller bonding areas as well as higher tape performance. Our tesa HAF® tapes are successfully used in many of these applications and offer not only superior bonding strength and shock resistance but also durability and environmental resistance on a broad variety of substrates. Because of these features, our adhesive tapes meet all the requirements of structural bonding.

Anti-Repulsion
Fabric Mounting
Logo Mounting

Anti-Repulsion

Fabric Mounting

Logo Mounting

Applications Examples

  • FPC stiffening
  • Frame mounting/enclosure assembly
  • Magnesium bracket mounting

Our Solutions

  • tesa reactive HAF®
  • tesa anti-shock reactive HAF®
  • tesa low-temperature reactive HAF®
  • tesa thermoplastic HAF®
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Products

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tesa® 8444
Specifications
none
copolyester
100 µm
tesa HAF® 8451
Specifications
none
nitrile rubber / phenolic resin
200 µm
tesa HAF® 8454
Specifications
none
nitrile rubber / phenolic resin
100 µm
tesa® 8462
Specifications
none
copolyester
50 µm
tesa® 8466
Specifications
non-woven
copolyester
150 µm
tesa HAF® 8471
Specifications
none
nitrile rubber / phenolic resin
30 µm
tesa HAF® 8472
Specifications
none
nitrile rubber / phenolic resin
60 µm
tesa HAF® 8473
Specifications
none
nitrile rubber / phenolic resin
80 µm
tesa HAF® 8474
Specifications
none
nitrile rubber / phenolic resin
100 µm
tesa HAF® 8475
Specifications
none
nitrile rubber / phenolic resin
125 µm
tesa HAF® 8476
Specifications
none
nitrile rubber / phenolic resin
150 µm
tesa HAF® 8478
Specifications
none
nitrile rubber / phenolic resin
200 µm
tesa® LTR HAF 8710
Specifications
none
low temperature activated reactive adhesive
50 µm
tesa® LTR HAF 8711
Specifications
none
low temperature activated reactive adhesive
30 µm
tesa® LTR HAF 8714
Specifications
none
low temperature activated reactive adhesive
100 µm
tesa® LTR HAF 8715
Specifications
none
low temperature activated reactive adhesive
125 µm
tesa HAF® 58469
Specifications
none
nitrile rubber / phenolic resin
10 µm
tesa HAF® 58470
Specifications
none
nitrile rubber / phenolic resin
50 µm
tesa HAF® 58471
Specifications
none
nitrile rubber / phenolic resin
30 µm
tesa HAF® 58473
Specifications
none
nitrile rubber / phenolic resin
80 µm
tesa HAF® 58474
Specifications
none
nitrile rubber / phenolic resin
100 µm
tesa HAF® 58475
Specifications
none
nitrile rubber / phenolic resin
125 µm
tesa HAF® 58476
Specifications
none
nitrile rubber / phenolic resin
150 µm
tesa HAF® 58477
Specifications
none
nitrile rubber / phenolic resin
20 µm
tesa HAF® 58478
Specifications
none
nitrile rubber / phenolic resin
200 µm
tesa® LTR HAF 58480
Specifications
none
low temperature activated reactive adhesive
50 µm
tesa® LTR HAF 58484
Specifications
none
low temperature activated reactive adhesive
100 µm
tesa® LTR HAF 58485
Specifications
none
low temperature activated reactive adhesive
125 µm
tesa® LTR HAF 58486
Specifications
none
low temperature activated reactive adhesive
150 µm
tesa HAF® 58492
Specifications
PET
nitrile rubber / phenolic resin
72 µm
tesa HAF® 58493
Specifications
PET
nitrile rubber / phenolic resin
83 µm
tesa HAF® 58495
Specifications
PET
nitrile rubber / phenolic resin
123 µm
tesa HAF® 58498
Specifications
PET
nitrile rubber / phenolic resin
200 µm
tesa HAF® 58499
Specifications
PET
nitrile rubber / phenolic resin
200 µm