tesa HAF® 8430

45µm amber reactive HAF mounting tape



Product description

tesa HAF® 8430 is a reactive heat activated film based on phenolic resin and nitrile rubber. This amber double sided tape has no backing. It is protected by a strong paper liner and can easily be slit and die cut.


At room temperature tesa HAF® 8430 is not tacky. It is activated by heat and pressure applied over a certain period of time.


Special Features
  • Reliable chip module bonding
  • Suitable for PVC, ABS, PET, and PC cards
  • Good workability on all common implanting lines
  • Outstanding ageing resistance
  • Lifelong flexibility due to high rubber content

Main applications

tesa HAF® 8430 is especially designed for the embedding of chip-modules into smart cards. It is also suitable for bonding of all thermal resistant materials such as metal, glass, plastic, wood and textiles e.g. friction liners for clutches).

Technical properties

Shelf life time < 25°C

_NULL months

Bonding strength

_NULL N/mm²

Type of adhesive

nitrile rubber / phenolic resin

Shelf life time < 15°C

_NULL months

Type of liner

glassine

Bonding strength (dynamic shear)

12 N/mm²

Shelf life time < 5°C

_NULL months

Total thickness

45 µm

Backing material

none

Color

amber

Additional Info

Technical recommendations for Smart Card applications:
tesa HAF® 8430 is not self adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip modules as well as customer requirements.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination step does not affect the shelf life time of the adhesive tape. Pre-laminated belts can be stored over the same period of time as the adhesive tape.
Machine setting:
  • Temperature 120 – 140 °C
  • Pressure 2 – 3 bar
  • Time 2.5 m/min
2. Module embedding:
During module embedding, the pre-laminated modules are cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of implanting line, single-step or multiple-step process are possible. Today, most implanting machines have multiple heat press steps.
Single-step process - machine setting:
  • Temperature¹ 180 – 200 °C
  • Pressure 65 – 75 N/module
  • Time 1.5 s
Multiple-step process - machine setting:
  • Temperature¹ 180 – 200 °C
  • Pressure 65 – 75 N/module
  • Time 2 x 0.7 s / 3 x 0.5 s
¹ Temperature measured inside the heating stamp. Different temperature settings recommended for different card materials:
PVC and ABS: 180 – 190 °C
PET and PC: 190 – 200 °C
Bonding strength values were obtained under standard laboratory conditions. Value is specification limit checked for each production batch (material: etched aluminum test specimen / bonding conditions: Temp. = 120 °C; pressure = 10 bar; time = 8 min). To reach maximum bonding strength, surfaces should be clean and dry.

tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.

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