tesa® HAF 8412 ACF

45µm Anisotropic conductive heat activated adhesive film



Product description

tesa® HAF 8412 ACF is an anisotropic conductive, heat activated, brown adhesive film based on reactive phenolic resin and nitrile rubber containing conductive particles.

tesa® HAF 8412 ACF features especially:
  • Anisotropic conductivity
  • Mechanical module embedding and electrical connectivity in one step
  • Good workability on all common implanting lines
  • Suitable for PVC, ABS, PET and PC cards
  • Good ageing resistance

Thickness: 45 µm (mean value of particle size)

Main applications

tesa® HAF 8412 ACF is designed for the embedding of chip-modules into dual interface smart cards for non-contact and contact based applications.

Technical properties

Type of adhesive

nitrile rubber / phenolic resin

Type of liner

glassine

Backing material

none

Colour

amber

Additional Info

Technical Recommendations:
The following values are recommendation for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.

1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. This step can be performed inline or offline. The pre-lamination step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.

Machine setting:
  • Temperature 130 – 150 °C
  • Pressure 4 – 6 bar
  • Time 1,5 – 3,0 s

2. Module Embedding:
During module embedding, the pre-laminated modules are die cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat. For this step, the exact handling depends on the type of the implanting line used. Today, two different ways are most common:

Single step process - Machine setting (low temperature):
  • Temperature¹ 160 – 180 °C
  • Pressure 80 - 130 N/module
  • Time 2,0 – 4,0 s
Single step process - Machine setting (high temperature):
  • Temperature¹ 180 – 200 °C
  • Pressure 80 - 130 N/module
  • Time 1,0 – 1,5 s

Multiple step process (2 or more heating stamps) - Machine setting:
  • Temperature¹ 170 – 200 °C
  • Pressure 80 - 130 N/module
  • Time (for each step) 0,7 – 1,2 s

¹ Temperature as measured inside the heating stamp

Storage conditions according to tesa® HAF shelf life concept.

tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.

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