tesa® UV epoxy 8488 Chemical Resistance

tesa^® UV epoxy is a reactive adhesive. It is activated by UV light and can be used for bonding of opaque or translucent substrates.
Bonding of opaque substrates
The open time of tesa^® UV epoxy enables the bonding of opaque substrates like plastics and metals. tesa^® UV epoxy can be activated by UV light before or after bonding to the first substrate.
Activation before bonding: The die-cut of tesa^® UV epoxy is activated by UV light. The covering liner of the die-cut must be light-permeable (e.g., clear PET) to enable the activation of the tape. After activation the die-cut is bonded onto the first substrate. The second substrate is then bonded within 10 minutes by applying pressure (≥ 3 bar).
Activation after bonding to the first substrate: The die-cut of tesa^® UV epoxy is bonded onto the first substrate. After activation by UV light, the second substrate is bonded within 10 minutes by applying pressure (≥ 3 bar).
Bonding of translucent substrates
Translucent substrates such as clear plastics can be bonded before activation by UV light. At least one substrate must be light-permeable to allow the activation of tesa^® UV epoxy. After applying tesa^® UV epoxy to the first substrate, the second substrate is bonded by applying pressure (≥ 3 bar). The bonded parts are then exposed to UV light to start the curing of the adhesive.
Pre-lamination conditions

• Before curing, tesa^® UV epoxy has initial tack and can be applied like a common PSA tape
• A pressure of ≥ 1 bar should be applied to ensure proper wet-out to the surface

Activation and bonding parameters

• Light source: 365 nm UV-A
• Light dose: 2.5-5 J/cm²
• Recommended pressure: ≥ 3 bar
• Recommended bonding time: ≥ 10 s

Bonding strength values were obtained under standard laboratory conditions. (Material: SUS test specimen / bonding conditions: UV dose: 4.5 J/cm² at 365 nm; pressure: 5 bar for 30 s). To reach maximum bonding strength surfaces should be clean and dry.