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tesa HAF® 8414 is a translucent heat-activated adhesive film that contains electrically conductive particles.
1 Chip module bonding and electrical connectivity in one step
1 Good workability on all common implanting lines
1 Suitable for PVC, ABS and PC cards (Dual Interface (D.I.) and contactless cards)
1 Suitable for silver ink substrates and wire antenna
Mean particle diameter: 40 µm
tesa HAF® 8414 is designed for all applications where reliable electrical connections and strong bonds are required. Lead applications are chip module embedding in Dual Interface (DI) cards and for RFID tags.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
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