TES5620_AUTO_Connected_interior_Campaign_video_INTRO

Join us at LOPEC 
25-26 February 2026
Stand B0.507

Technologies

Innovating together for the future of printed electronics

We enable and protect your next generation of printed electronics by developing multiple state-of-the-art applications, such as bonding, mounting, sealing, cushioning, shielding, and encapsulation. Our advanced electronic adhesive solutions allow for precise application at high production rates and reliable performance.

Cell Research, Scientist placing a multi well plate under the microscope ready to examine cells in the laboratory

01Protection Solutions

We create advanced adhesive solutions, designed to protect printed electronics from environmental stress, wear, contamination, ensuring durability and reliability. 

A woman in a blue lab coat and safety glasses examines disassembled smartphone components on a conveyor belt in a factory setting. She holds a tool and wears gloves, indicating a focus on detail and safety in the work environment. All the components are secured with tesa tape for precision assembly. (This text has been generated by AI)

02Enabling Scalability

We work closely with our partners to efficiently scale production processes with adhesive solutions tailored to the demands of manufacturing.

Two Professional Heavy Industry Employees in Hard Hats at Factory. Checking and Discussing Industrial Facility, Working on Laptop Computer. African American Engineer and Asian Technician at Work.

03Collaborative Innovation

Close partnerships for powerful innovation, offering co-engineering and custom solutions from prototype to production.



 



 

Discover a selection of adhesive solutions for printed electronics

We develop cutting-edge adhesives for electronic components for a wide range of applications-including bonding, mounting, sealing, cushioning, shielding and encapsulation that solve our customers’ challenges – today and tomorrow.