Additional Info
Thermal conductivity measured by ASTM DS470
tesa® 60744
tesa® 60744 50 μm/2 mils thermal management tape
Product Features
- High thermal conductivity in z-direction
- Strong bonding strength
- Excellent surface wet-out
Product description
tesa® 60744 is a thermal management transfer tape which is designed for high thermal conductivity with strong mounting on heat source or heat spreading material such as display, MLB, and components in electronics devices.
Product details and specifications
Product Features
- High thermal conductivity in z-direction
- Strong bonding strength
- Excellent surface wet-out
- Easy handling
- Thin design
- Excellent electrical insulation
Application Fields
- Component mounting wherever heat transfer is needed
- Heat dissipation from MLB / FPC to heat spreader
- Display mounting and heat transfer to other substrate
- Vapor chamber or heat pipe mounting
- Antenna mounting
- Graphite sheet mounting
| Adhesive Type | acrylic |
|---|---|
| Backing material | none |
| Color | white |
| Color of liner | transparent |
| Liner Type | PET film |
| Total thickness | 50 µm |
| Breakdown voltage | 2.9 KV |
|---|---|
| Wetting | 84 % |
| Thermal conductivity z-direction | 1 W/mK |
| Adhesion to Steel (initial) |
2.86 lbs/in
5 N/cm |
|---|
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
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Last updated on Apr 16, 2024