The future of foldable devices is all about pushing the boundaries of innovation. We’re here to support manufacturers in achieving the ultimate balance of strength and slimness, while offering flexibility, durability, and reworkability throughout the design process. As the demand for thinner, stronger devices grows, our tailored adhesive solutions are engineered to meet these evolving challenges.
Our ultra-thin pressure-sensitive adhesives (PSAs) for battery mounting maximize internal space, ensuring secure and reliable bonding. For thermal management, our PSAs efficiently dissipate heat in compact designs, preventing overheating and keeping heat-sensitive components stable. Additionally, our electrically conductive tapes are essential for gap-filling and providing effective EMI shielding, ensuring your devices perform reliably, even as they become thinner and more compact. Designed to optimize space and enhance performance, we’re helping you bring the future to life. Together, we’re shaping what’s next in foldable technology.