Module producers often require a tape to hold the ribbons down and temporarily cover the slit backsheet during the lamination process. This prevents contamination of the laminator and ensures efficient assembly by workers during the back-end process.
We recommend a product with high adhesion to a wide range of backsheets, high temperature resistance and very good removability.
- 220°C temperature resistance
- Excellent removability after lamination
- Safe temporary sealing of holes
- No residues on backsheet