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Permanent bonding of a chip module into the cavity of substrates is crucial for all smart card manufacturers to ensure the cards function properly in daily applications. For contact card assembly processes, we offer tesa HAF®, a complete range of Heat-Activated Films with a high level of bonding strength to a variety of card substrates.
The market for Dual Interface cards (DI cards) is booming, especially for payment and identity cards. DI cards require a reliable connection between the antenna and the chip module. For DI card assembly processes, we offer tesa® ACF 8414, an anisotropic conductive hotmelt film that can be adapted to common assembly lines without investments. Mechanically embedding the module and electrically contacting the antenna are now performed in a single step, which is as easy as the assembly of contact cards.
Everyday a large variety of cards are produced to meet today’s personal and business needs. These cards range from banking cards to identifications badges to gift cards and beyond. Up to 20 percent of the manufactured cards are attached to a letter and sent to the end customer by mail. For mailing assembly, we offer tesa’s card label solutions, a complete range of removal labels and endless rolls to attach the cards onto letters.
Advantages of using tesa card label products: