Structural Bonding for Increased Device Stability

Electronic devices are becoming more and more miniaturized and sophisticated. Complex designs require smaller bonding areas as well as higher tape performance. Our tesa HAF® tapes are successfully used in many of these applications and offer not only superior bonding strength and shock resistance but also durability and environmental resistance on a broad variety of substrates. Because of these features, our adhesive tapes meet all the requirements of structural bonding.

• FPC stiffening
• Frame mounting/enclosure assembly
• Magnesium bracket mounting

Our Solutions

• tesa reactive HAF®
• tesa anti-shock reactive HAF®
• tesa low-temperature reactive HAF®
• tesa thermoplastic HAF®