Electronics. Structural Bonding Application
Structural Bonding for Increased Device Stability

Structural Bonding for Increased Device Stability

Increased device stability with our structural bonding solutions: tesa HAF®.



Superior Bonding Strength Even on Small Bonding Areas

Electronic devices are becoming more and more miniaturized and sophisticated. Complex designs require smaller bonding areas as well as higher tape performance. Our tesa HAF® tapes are successfully used in many of these applications and offer not only superior bonding strength and shock resistance but also durability and environmental resistance on a broad variety of substrates. Because of these features, our adhesive tapes meet all the requirements of structural bonding.

Anti-Repulsion
Fabric Mounting
Logo Mounting

Anti-Repulsion

Fabric Mounting

Logo Mounting

Applications Examples

  • FPC stiffening
  • Frame mounting/enclosure assembly
  • Magnesium bracket mounting

Our Solutions

  • tesa reactive HAF®
  • tesa anti-shock reactive HAF®
  • tesa low-temperature reactive HAF®
  • tesa thermoplastic HAF®
Read more

Products

Show filters
tesa® 8444
Specifications
none
copolyester
3.93 mils
tesa® HAF 8454 E&E
Specifications
none
nitrile rubber / phenolic resin
3.93 mils
tesa® 8462
Specifications
none
copolyester
1.96 mils
tesa® 8466
Specifications
non-woven
copolyester
5.9 mils
tesa® HAF 8471
Specifications
none
nitrile rubber / phenolic resin
1.18 mils
tesa® HAF 8472
Specifications
none
nitrile rubber / phenolic resin
2.36 mils
tesa® HAF 8473
Specifications
none
nitrile rubber / phenolic resin
3.14 mils
tesa® HAF 8474
Specifications
none
nitrile rubber / phenolic resin
3.93 mils
tesa® HAF 8475
Specifications
none
nitrile rubber / phenolic resin
4.92 mils
tesa® HAF 8478
Specifications
none
nitrile rubber / phenolic resin
7.87 mils
tesa® HAF 58474
Specifications
none
nitrile rubber / phenolic resin
3.93 mils
tesa® HAF 58478
Specifications
none
nitrile rubber / phenolic resin
7.87 mils
Downloads