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The future of product design: debonding tape technology

Technologies

Today, we are committed to creating smarter, more sustainable, and easily repairable products. But traditional permanent bonding often creates barriers to innovation and circular economic principles. Being able to remove adhesives without leaving residue behind would be a game-changer. It would allow easy access to repair, recycle, and upgrade products. Enter: debonding tapes, the future of product design.

It was this exact sentiment that inspired us to develop our range of debonding tapes. This innovative adhesive solution provides a strong bond and clean removal when required. Our goal is to help designers and manufacturers:

We started this journey more than a decade ago with our groundbreaking tesa® Bond & Detach technology, which set a new standard for residue-free tape removal. Building on this breakthrough, we are now exploring even more advanced solutions. 

Our latest developments include debonding tapes that respond to various triggers such as electricity, induction, infrared light, or heat. This advancement in bonding is set to transform and revolutionize the adhesive industry.

Debonding tapes provide fast, safe, and reliable bonds with exceptional strength. Yet they can be completely removed whenever required. This innovative solution enables our customers to conserve resources, promote sustainability, maintain a competitive edge, and adapt to changing regulations with confidence.

Debonding tapes enable resource savings and promote circularity.

tesa’s Bond & Detach® solutions are used in more than 1.8 billion smartphones worldwide.

A diverse and growing range of debonding methods is now being integrated into adhesive tapes for a wide variety of products. This makes it possible to rework parts during production, save resources, and cut waste materials.

Through improving the ability to repair products, their lifecycle is extended. Naturally, this helps reduce the need to manufacture replacements. Additionally, being able to disassemble products residue-free improves recyclability. As a whole, the transition to debonding tapes supports a more circular economy. Win, win, win.

We work with OEMs to create innovative adhesive solutions for modern manufacturing pain points. In particular, our focus has been on debonding tapes, and our product development is already at an advanced stage. In particular, our renowned tesa® Bond & Detach tape allows for mechanical release without leaving any residue.

50+ the number of patents filed by our scientific experts at tesa for Debonding on Demand adhesive tapes

A person is using a plastic tool to remove the back cover of a smartphone placed on a table. The phones battery and internals are visible. The persons hand is slightly blurred, suggesting movement. (This text has been generated by AI)

Looking ahead, structural adhesives will also become debondable through various mechanisms. One of our product development goals is to make the disassembly of products as non-destructive as possible. We believe that early engagement with our customers is key to driving such innovations. Together, we are looking at ways to incorporate debonding mechanisms into the substrate, material, and overall product design.

The mechanisms for our Debonding tapes:

Debonding on Demand_Electrical Release

01Debonding on Demand – Electrical debonding

Low-voltage electricity causes electrochemical reactions. This allows debonding of the adhesive within a few seconds.

Laser debonding - LTC 1 (1)

02Debonding on Demand – Laser debonding

In just a few seconds, light from a Near Infrared (NIR) laser weakens the tape structure – causing it to debond.

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03Debonding on Demand – Stretching & debonding

Developed from the famous tesa® Powerstrips, tesa® Bond & Detach tapes feature a tab users can pull to remove the tape by reducing the bonding strength via stretching.

Debonding on Demand_Thermal Debonding Joule Heating

04Debonding on Demand – Thermal debonding – Joule Heating

Several methods allow for thermal release. For example, heat can be generated conventionally. This causes the adhesive to foam, so the tape will separate.

Debonding on Demand_Thermal Debonding Induction

05Debonding on Demand – Thermal debonding – Induction

Debonding can also be achieved by generating locally. Electromagnetic fields are used to generate heat through a metal strip built into the tape that causes the bond to separate. This is best suited to appliances like modern kitchen ovens.

Our range of Bond & Detach® tapes

tesa bond and detach double sided transparent

01tesa® 70350 Bond & Detach®

  • Thickness: 500µm
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive
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02tesa® 70415 Bond & Detach®

  • Thickness: 150µm
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive
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03tesa® 70425 Bond & Detach®

  • Thickness: 250µm
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive
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04tesa® 60619 Bond & Detach®

  • Thickness: 250µm
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive
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05tesa® 70420 Bond & Detach

  • Thickness: 200µm/7.87 mils
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive
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06tesa® 70440 Bond & Detach®

  • Thickness: 400µm/15.8 mils
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive
Product-Illustration_Bond-and-Detach_704x_300dpi.png

07tesa® 70465 Bond & Detach®

  • Thickness: 650µm/25.6 mils
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive
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08tesa® 70410 Bond & Detach®

  • Thickness: 100µm
  • Very high bonding strength
  • Superior push-out and shock resistance
  • Easy removability even after a long bonding time by stretching the adhesive

tesa Debonding on Demand FAQs

No, debonding on demand does not affect the load-bearing capacity of products. This method is designed to remove adhesives without damaging the structural integrity of the product. tesa also offers debonding tapes for structural bonding. This means for permanent and very strong bonding applications. These bonds can also be removed without affecting the load-bearing capacity of the products.

At present, the debonding tapes themselves cannot be reused, but all the components released by the debonding process can be reused, repaired or, if required, recycled.

Debonding on demand helps generate less waste for several reasons. Firstly, adhesive bonds can be removed and repositioned during the production process, eliminating the need to discard items due to incorrect bonding. Additionally, items that can be repaired or recycled after use reduce waste, as they are not thrown away and recycled materials can re-enter the production cycle. Therefore, debonding on demand offers significant potential to reduce waste in the near future.

Yes, Debonding on Demand can be integrated into existing production processes. It is designed to be adaptable and can be implemented without significant changes to current manufacturing operations but overall allowing for greater flexibility and efficiency. Depending on the application, a decision on the appropriate debonding mechanism should be made in advance. tesa advises its customers on the best method to use.

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Find the perfect debonding tape for your needs

We offer a wide range of debondable tapes, with a variety of removal methods. Whatever your application, we’ll help you find the ideal solution. Contact us today.

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