As electronic devices become more compact, component makers face increasing pressure to deliver thinner, lighter, and more durable designs. tesa’s future-ready component adhesive solutions, collaborative approach to solving specific challenges, and proven reliability, deliver the support and innovation you need to adapt today, and develop tomorrow’s breakthroughs.
tesa’s ultra-thin formats ensure superior bonding strength down to 5 μm and are optimized for mounting FPC, antennas, membranes and complex applications within functional components: e.g. speakers, camera modules, etc. Our microscale mounting solutions are also specifically engineered for tight spaces and curved surfaces, and provide:
Our collaborative approach to partnership and product iteration enables us to co-develop bonding solutions tailored to your process needs and design challenges.
A global network of local engineering expertise also means more on-site technical support, faster troubleshooting and design adaptation that mirrors your production requirements. Partnering with tesa brings you:
Designed for the next generation of components, our bonding solutions support a range of formats, materials, surfaces and applications. This includes emerging architectures in FPC, antenna, speakers, sensors and camera modules. Our expert application teams also provide a wealth of cross-device experience to reduce trial and error waste and promote optimal material usage.
Solutions designed for the next generation of components:
Solutions
General component mounting
Bended FPC / curved antenna mounting
FPC mounting before SMT (reflow)
Solutions
Component shielding and grounding
Mounting and grounding for small bonding areas
Solutions
Bended FPC mounting
Membrane mounting
Sensor mounting
Dome mounting within speaker modules
Solutions
Bonding and residue-free removal
Side key FPC mounting
Here are six ways tesa’s future-ready microscale mounting solutions can help you meet your evolving challenges:
