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for increased device reliability
Electronic devices are increasingly miniaturized and sophisticated. Complex designs require smaller bonding areas and higher tape performance. tesa® Structural Bonding Solutions meet the most challenging demands of manufacturers and consumers over the life cycle of the devices. They provide high structural bonding performance to a wide variety of substrates with both fast and durable bonds. They withstand the harshest conditions by combining outstanding chemical and aging resistance with excellent sealing properties even on temperature-sensitive substrates. The processing of these adhesive systems is simplified due to excellent die-cutting properties, immediate handling stability after heat activation, and low oozing.
Our assortment consists of heat-activated films and low-temperature reactive films. Here you will find an overview of the available products and their special properties.
tesa HAF® 5847x/847x
tesa HAF® is a heat-activated film based on phenolic resin and nitrile rubber. It is activated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds and outstanding reliability.
tesa® XPU 5870x/870x
tesa® Cross-Linkable Polyurethane (XPU) is activated by very low bonding pressure and temperatures from 110°C to 200°C. Our XPU series offer strong and reliable bonding strength – even on combinations of different substrates like plastics and metals.
tesa® LTR 5848x/871x/872x
tesa® LTR is especially recommended for the reliable bonding of temperature-sensitive substrates. The LTR 5848x and 871x series bond extremely well to plastics and leather, while LTR 872x is specifically designed for the bonding of fabrics.
tesa® LTC 5866x
Our new tesa® LTC combines an outstanding bonding performance with excellent shock and chemical resistance on a wide variety of substrates. It is designed for demanding bonding applications of temperature sensitive electronic parts or near sensitive components.
tesa® Structural Bonding Solutions are not tacky at room temperature and get activated by heat and pressure applied during the assembly process. By supplying heat, an irreversible chemical reaction is started that creates the high bonding strength and the resistance to high temperatures and chemicals. Using a heat press is the most common way to bond parts with tesa® Structural Bonding Solutions. It provides a fast, clean and reliable bonding process. For more temperature-sensitive applications alternative bonding processes, such as post oven curing or laser bonding can be used.
|Product||tesa HAF® 847x/5847x||tesa® XPU 870x/5870x||tesa® LTR 871x/5848||tesa® LTC 5866x|
|Color||Amber, Black||Translucent, Black||White, Black||Black|
|Thickness range [µm]||10 - 200||25 - 200||30 - 300||50 - 100|
|Activation Temperature [°C]||>120||>110||>75||>80|
|Adhesive||Nitrile rubber/phenolic resin||Cross-linkable polyurethane||Cross-linkable polyurethane||Cross-linkable polyurethane|
|Dynamic Shear [N]||>6.0||n.a.||n.a.||n.a.|
|Sampling||Request product sample||Request product sample||Request product sample||Request product sample|
Our tape experts would be very happy to help you master your challenges.