tesa_Electronics_Smartwatch-with-waterdrops

Structural Bonding Solutions

for increased device reliability

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Electronic devices are increasingly miniaturized and sophisticated. Complex designs require smaller bonding areas and higher tape performance. tesa® Structural Bonding Solutions meet the most challenging demands of manufacturers and consumers over the life cycle of the devices. They provide high structural bonding performance to a wide variety of substrates with both fast and durable bonds. They withstand the harshest conditions by combining outstanding chemical and aging resistance with excellent sealing properties even on temperature-sensitive substrates. The processing of these adhesive systems is simplified due to excellent die-cutting properties, immediate handling stability after heat activation, and low oozing. 

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Typical Applications of our Structural Bonding Solutions

The cover (the lens) of a smartwatch must be bonded to the housing with the utmost precision during the manufacturing process. The tape (red) has to meet a wide range of requirements, providing high adhesive strength, shock resistance, and resistance to chemical substances.
Lens and back cover mounting

To protect electronics from challenging environments structural bonding films must achieve not only a high bonding strength but also a high chemical and impact resistance. tesa® LTC helps to seal and protect electronic devices by an outstanding bonding performance and excellent reliability.

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tesa-electronics-fpc-mounting-grounding-illustration
FPC bonding

FPC bonding requires the best reliable bonding performance to make sure the FPCs stay bonded even around curved or bended designs. tesa® HAF is the perfect fit for demanding FPC applications as it provides a high repulsion resistance even at elevated temperatures.

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tesa_Electronics_fabric-mounting_headphones-illustration
Soft good and accessories

In soft good applications the activation temperatures must be low enough to protect substrates like textiles, leather and plastics. Still the bond must be resistant to harsh environments, such as extreme temperatures and elevated humidity. tesa® LTR is great for soft goods applications that require tough durable bonds and fast and clean manufacturing processes.

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EAF_Trackpad_300dpi
Component mounting

To achieve even lighter and more efficient electronic devices manufactures are using new material combinations in the construction of their devices. This poses a new challenge that have to be met: tesa® XPU has it’s strength in bonding differential substrates as it can compensate the different thermal expansion of the substrates.

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Discuss your individual application!


Our Structural Bonding Assortment

Our assortment consists of heat-activated films and low-temperature reactive films. Here you will find an overview of the available products and their special properties.

Heat Activated Films
Low-Temperature Reactive Films
HAF_Features
Main features

tesa HAF® 5847x/847x

tesa HAF® is a heat-activated film based on phenolic resin and nitrile rubber. It is activated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds and outstanding reliability.

Reference applications:

  • FPC mounting
  • Camera lens mounting
  • Metal bonding

More details.

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XPU_Features
Main features

tesa® XPU 5870x/870x

tesa® Cross-Linkable Polyurethane (XPU) is activated by very low bonding pressure and temperatures from 110°C to 200°C. Our XPU series offer strong and reliable bonding strength – even on combinations of different substrates like plastics and metals.

Reference applications:

  • Trackpad mounting
  • Metal mesh
  • Speaker membrane
  • Metal or plastic bonding

More details.

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LTR_Features
Main features

tesa® LTR 5848x/871x/872x

tesa® LTR is especially recommended for the reliable bonding of temperature-sensitive substrates. The LTR 5848x and 871x series bond extremely well to plastics and leather, while LTR 872x is specifically designed for the bonding of fabrics.

Reference applications:

  • Plastic to fabric bonding in earphones
  • Speaker mesh bonding
  • Plastis, fabrics and leather bonding

More details.

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LTC_Features
Main features

tesa® LTC 5866x

Our new tesa® LTC combines an outstanding bonding performance with excellent shock and chemical resistance on a wide variety of substrates. It is designed for demanding bonding applications of temperature sensitive electronic parts or near sensitive components.

Reference applications:

  • Cover glass mounting
  • Back cover mounting
  • Plastic to metal bonding

More details.

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Activation Process of our Structural Bonding Solutions

Heat Press Activation of Structural Bonding Solutions
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Heat Press Activation of Structural Bonding Solutions

tesa® Structural Bonding Solutions are not tacky at room temperature and get activated by heat and pressure applied during the assembly process. By supplying heat, an irreversible chemical reaction is started that creates the high bonding strength and the resistance to high temperatures and chemicals. Using a heat press is the most common way to bond parts with tesa® Structural Bonding Solutions. It provides a fast, clean and reliable bonding process. For more temperature-sensitive applications alternative bonding processes, such as post oven curing or laser bonding can be used.


Product comparison

Product
Color
Thickness range [µm]
Activation Temperature [°C]
Adhesive
Push-out [MPa]
Dynamic Shear [N]
DuPont [J]
ReliabilityAssessment is done only in relation to other products of this assortment
Chemical ResistanceAssessment is done only in relation to other products of this assortment
Reference
Sampling
tesa HAF® 847x/5847x

Amber, Black

10 - 200

>120

Nitrile rubber/phenolic resin

>5.0

>6.0

>0.5

●●●●

●●●●

SUS/SUS

tesa® XPU 870x/5870x

Translucent, Black

25 - 200

>110

Cross-linkable polyurethane

>4.0

n.a.

>3.5

●●●

●●

AI/PC

tesa® LTR 871x/5848

White, Black

30 - 300

>75

Cross-linkable polyurethane

>5.5

n.a.

>4.0

●●●

●●

PC/PC

tesa® LTC 5866x

Black

50 - 100

>80

Cross-linkable polyurethane

n.a.

n.a.

n.a.

●●●●

●●●

SUS/SUS


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