Additional Info
Technical Recommendations for smart card applications:
The following values are recommendations for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. This step can be performed inline or offline. The pre-lamination step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.
Machine setting:
During module embedding, the pre-laminated modules are die cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat. For this step, the exact handling depends on the type of the implanting line used. Today, two different ways are most common:
Single step process - Machine setting (low temperature):
¹ Temperature as measured inside the heating stamp
For other applications than smart card different machine parameters should be used. Storage conditions according to tesa® HAF shelf life concept.
Note: Bonding strength values were obtained under standard laboratory conditions (Mean values). Value is guaranteed clearance limit checked with each production batch (Material: Etched aluminium test specimen / Bonding conditions: Temp. = 120 °C; p = 10 bar; t = 8 min)
The following values are recommendations for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. This step can be performed inline or offline. The pre-lamination step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.
Machine setting:
- Temperature 120 – 140 °C
- Pressure 4 – 6 bar
- Time 1,5 – 3,0 s
During module embedding, the pre-laminated modules are die cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat. For this step, the exact handling depends on the type of the implanting line used. Today, two different ways are most common:
Single step process - Machine setting (low temperature):
- Temperature¹ 160 – 180 °C
- Pressure 65 N/module
- Time 2,0 – 4,0 s
- Temperature¹ 180 – 200 °C
- Pressure 65 N/module
- Time 1,0 – 1,5 s
- Temperature¹ 170 – 200 °C
- Pressure 65 N/module
- Time (for each step) 0,7 – 1,2 s
¹ Temperature as measured inside the heating stamp
For other applications than smart card different machine parameters should be used. Storage conditions according to tesa® HAF shelf life concept.
Note: Bonding strength values were obtained under standard laboratory conditions (Mean values). Value is guaranteed clearance limit checked with each production batch (Material: Etched aluminium test specimen / Bonding conditions: Temp. = 120 °C; p = 10 bar; t = 8 min)
