tesa HAF® 8412 ACF

Technical Recommendations:
The following values are recommendation for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.

1.Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination
step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.

Machine setting:

¹ Temperature 130 – 150 °C

¹ Pressure 2 – 3 bar

¹ Speed 1.5 – 2.5 m/min

2. Module Embedding:
During module embedding, the pre-laminated modules are die-cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of the implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.

Single step process – Machine setting:

¹ Temperature¹ 180 – 220 °C

¹ Pressure 80 – 130 N/module

¹ Time 1.5 s
Multiple step process (2 or more heating stamps) – Machine setting:

¹ Temperature¹ 180 - 220 °C

¹ Pressure 80 - 130 N/module

¹ Time 2 x 0.7 s / 3 x 0.5 s

¹Temperature recommendations refer to what can be measured inside the heating stamp. Different temperature settings are recommended for different card material:

PVC 180 – 190 °C
ABS 180 – 190 °C
PET 190 – 200 °C
PC 200 – 220 °C

To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa® HAF shelf life concept