Structural Bonding Solutions

Increased device stability with our structural bonding solutions

Electronic devices are increasingly miniaturized and sophisticated. Complex designs require smaller bonding areas and higher tape performance. tesa® structural bonding solutions meet the most challenging demands of manufacturers and consumers over the life cycle of the devices. They provide high structural bonding performance to a wide variety of substrates with both fast and durable bonds. They withstand the harshest conditions by combining outstanding chemical and aging resistance with excellent sealing properties. The processing of these adhesive systems is simplified due to excellent die-cuttability, immediate handling stability after heat activation, and low oozing.

Typical applications of our structural bonding solutions


Component mounting

Thin and narrow die-cuts, repulsion resistance and temperature resistance
The cover (the lens) of a smartwatch must be bonded to the housing with the utmost precision during the manufacturing process. The tape (red) has to meet a wide range of requirements, providing high adhesive strength, shock resistance, and resistance to chemical substances.

Lens and back cover mounting

Chemical resistance, Impact resistance and reliable sealing properties
Fabric Mounting

Soft goods and accessories

Bonding of temperature-sensitive substrates, aging resistance and wettability on fabrics

Heat-Activated Films

Our tesa HAF® and tesa® XPU series are thermosetting adhesive systems. An irreversible cross-linking reaction is initiated by heat and pressure starting at temperatures above 110°C.

tesa HAF® 5847x/847x

tesa HAF® is a heat-activated film based on phenolic resin and nitrile rubber. It is activated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds and outstanding reliability.



tesa icon-chemical-resistance_2

Chemical resistance


Activation temperature


Temperature resistance

tesa® XPU 5870x/870x

tesa® Cross-Linkable Polyurethane (XPU) is activated by very low bonding pressure and temperatures from 110°C to 200°C. Our XPU series offer strong and reliable bonding strength – even on combinations of different substrates like plastics and metals.





Low bonding pressure


Impact resistance


Activation temperature

tesa® LTR 5848x/871x/872x

tesa® LTR is especially recommended for the reliable bonding of temperature-sensitive substrates. The LTR 5848x and 871x series bond extremely well to plastics and leather, while LTR 872x is specifically designed for the bonding of fabrics.




Activation temperature


Wettability on fabrics


Impact resistance

Can’t find the right solution?

We have more options available in our portfolio and by partnering with you we can create unique and specialized products that meet your individual demands.


Simply write to us or contact your local representative.


Assortment overview