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Component Mounting
Component Mounting
Small Parts with Big Impact.
Specific Mounting Applications
The general term component mounting covers a multitude of different applications, whose requirements for adhesive systems can differ significantly. In the following we provide you with a small overview of important component mounting applications, their general requirements and our proposed solutions. To ensure that you have the best possible solution for your unique project, please contact our local representatives.
Flexible Printed Circuit (FPC)
FPC mounting
Due to the limited space and small size of FPCs in electronic devices thin tapes with high adhesive strength are often used. These should be easy to cut. As FPCs are often bended up to 180° within the device anti-repulsion/anti-lifting properties may be needed.
Antenna
Antenna mounting
To mount the antenna it is critical for the tape solution to have a high adhesive strengths, epecially on LSE substrates as these are often used for antennas. A good repulsion resistance is needed as well. Depending on the specific antenna heat resistant or heat managing tapes should be preferred. Thin tapes are frequently used here.
Fingerprint sensor
Fingerprint sensor mounting
Different fingerprint sensor systems are currently used in the electronics industry. They all require good wetting properties to ensure shadow and bubble-free lamination. Furthermore, the tapes used should be reworkable. Ultrasonic fingerprint sensors have the additional requirement for EMI shielding.
Speaker mesh
Speaker mesh mounting
A very high bonding strength is crucial for this application, even on various substrates since the speaker mesh and the housing are often made out of different materials. Good sealing properties are required as well. A good die-cuttability and low oozing is recommended to avoid difficulties during the assembly process.
Trackpad
Trackpad mounting
A regular bonding must be ensured to support the optimal function of the trackpad. Therefore, bubble formation during processing should be prevented by good wetting properties. Once the trackpad is in place, a high stiffness of the full stack is advantageous.
Graphite Sheet
Graphite Sheet mounting
Especially important for graphite sheet lamination are good wetting properties to ensure bubble-free lamination. Furthermore, high initial adhesive strength is beneficial. Tapes used should be ultra-thin and meet economic aspects.
Rubber Foot
Rubber foot mounting
For the bonding of a rubber foot mainly high adhesive forces are required, especially on low surface energy (LSE) substrates like silicone. In addition, good shear resistance is often part of the requirement profile.
Component mounting solutions - Adhesive Systems for Your Success
Assortment
Thickness
range [μm]
5 - 300
10 - 300
50 – 400
150 - 500
80 - 1000
Color
Black
Transparent
Black
White
Amber
Translucent
Black
White
Black
White
Black
White
Transparent
Exemplary series used
Case studies
FPC
Antenna
Fingerprint
Speaker Mesh
Graphite Sheet
Trackpad
Rubber foot
and more
FPC
Speaker Mesh
Fingerprint
Trackpad
and more
Fingerprint
and more
Fingerprint
and more
FPC
and more
Use this assortment
when your main
requirements are
• Very good bonding
• Good wetting
• Efficient die-cuttability
• Specific properties (e.g., Anti-repulsion, Chemical resistant, Differential bonding properties, bonding on LSE substrates
and many more)
• Superior bonding power, even on small bonding areas
• Superior sealing properties
• Anti-repulsion
• Heat resistance
• Superior bonding
• Superior impact resistance
• Very good sealing and waterproofing
• Impact resistance
• Anti-repulsion
• Reworkability
• Superior, residue-free removability
• Impact resistance
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