8704

Technical recommendations: 기술적 정보
tesa® XPU 8704 is not self adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for bond line parameters to start with.

1. Pre-lamination:
During pre-lamination, laminate the adhesive tape onto the first component.

Setting:

• Temperature¹ 55-65 °C
• Pressure² 3 bar
• Time 5 – 20 s

Short-time exposure to 65 °C bond line temperature during pre-lamination does not impact final bonding potential.

2. Bonding:
Remove the liner from tape after the pre-lamination step.
Position the second component. Apply temperature and pressure for the bonding time to reach sufficient bonding strength.

2.1. PC/PC:
Setting:

• Temperature¹ 80 – 140 °C
• Pressure² 5 bar
• Time 10 – 120 s

2.2. AL/PC:
Setting:

• Temperature¹ 110 – 190 °C
• Pressure² 5 bar
• Time 20 – 120 s

Short cycle times can be achieved at high bond line temperatures. For activation at low temperatures, increase the heat-press time. To reach maximum bonding strength, surfaces should be clean and dry. Allow at least 1-2 hours dwell-time after bonding before performance testing. Final bonding strength will be reached after 24 hours.

Bonding strength values were obtained under standard laboratory conditions.
(PC/PC: bonding conditions: temperature = 110 °C (120°C jig); pressure = 5 bar; time = 60 sec / AL/PC: bonding conditions: temperature = 170 °C (180°C jig); pressure = 5 bar; time = 20 sec.)

Storage: tesa® recommends storage in original packaging in cool and dry conditions.

¹ ‘Pre-lamination’ and ‘Bonding’ temperature refer to the data that is measured in the bond line.
² ‘Pre-lamination’ and ‘Bonding’ pressure refer to the force that is transferred from jig surface directly to the bonding area.