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Structural Bonding Solutions

Structural Bonding Solutions

Increased device stability with our structural bonding solutions



Electronic devices are increasingly miniaturized and sophisticated. Complex designs require smaller bonding areas and higher tape performance. tesa ® structural bonding solutions meet the most challenging demands of manufacturers and consumers over the life cycle of the devices. They provide high structural bonding performance to a wide variety of substrates with both fast and durable bonds. They withstand the harshest conditions by combining outstanding chemical and aging resistance with excellent sealing properties. The processing of these adhesive systems is simplified due to excellent die-cuttability, immediate handling stability after heat activation, and low oozing.

Typical applications of our structural bonding solutions

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Component mounting

Thin and narrow die-cuts, repulsion resistance and temperature resistance

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제조 공정 중에 최대한 정밀하게 스마트와치의 커버(렌즈)를 하우징에 점착해야 합니다. 테이프(빨간색)는 다양한 요건을 충족해야 하며 높은 점착 강도, 내충격성 및 화학물질에 대한 저항성을 제공해야 합니다.
Lens and back cover mounting

Chemical resistance, Impact resistance and reliable sealing properties

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직물 마운팅
Soft goods and accessories

Bonding of temperature-sensitive substrates, aging resistance and wettability on fabrics

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Heat-Activated Films

Our tesa HAF® and tesa ® XPU series are thermosetting adhesive systems. An irreversible cross-linking reaction is initiated by heat and pressure starting at temperatures above 110°C.

tesa HAF® 5847x/847x

tesa HAF® is a heat-activated film based on phenolic resin and nitrile rubber. It is activated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds and outstanding reliability.

tesa ® XPU 5870x/870x

tesa ® Cross-Linkable Polyurethane (XPU) is activated by very low bonding pressure and temperatures from 110°C to 200°C. Our XPU series offer strong and reliable bonding strength – even on combinations of different substrates like plastics and metals.

 

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tesa ® LTR 5848x/871x/872x

tesa ® LTR is especially recommended for the reliable bonding of temperature-sensitive substrates. The LTR 5848x and 871x series bond extremely well to plastics and leather, while LTR 872x is specifically designed for the bonding of fabrics.

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Can’t find the right solution?

We have more options available in our portfolio and by partnering with you we can create unique and specialized products that meet your individual demands.

 

Simply write to us or contact your local representative.

electronics@tesa.com

Assortment overview

tesa® HAF 8471
Specifications
없음
니트릴고무 / 페놀수지
30 µm
tesa® HAF 8472
Specifications
없음
니트릴고무 / 페놀수지
60 µm
tesa® HAF 8473
Specifications
없음
니트릴고무 / 페놀수지
80 µm
tesa® HAF 8474
Specifications
없음
니트릴고무 / 페놀수지
100 µm
tesa® 8475
Specifications
없음
니트릴고무 / 페놀수지
125 µm
tesa® HAF 8476
Specifications
없음
니트릴고무 / 페놀수지
150 µm
tesa® HAF 8478
Specifications
없음
니트릴고무 / 페놀수지
200 µm
tesa® HAF 58470
Specifications
없음
니트릴고무 / 페놀수지
50 µm
tesa® HAF 58471
Specifications
없음
니트릴고무 / 페놀수지
30 µm
tesa® HAF 58473
Specifications
없음
니트릴고무 / 페놀수지
80 µm
tesa® HAF 58474
Specifications
없음
니트릴고무 / 페놀수지
100 µm
tesa® HAF 58475
Specifications
없음
니트릴고무 / 페놀수지
125 µm
tesa® HAF 58476
Specifications
없음
니트릴고무 / 페놀수지
150 µm
tesa® HAF 58478
Specifications
없음
니트릴고무 / 페놀수지
200 µm
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