tesa® HAF 8410 HS

60µm 황색 반응성 HAF 마운팅 테이프

  • tesa HAF® 8410은 상온에서 끈적이지 않습니다.
  • 본 제품의 점착력은 일정 시간 동안 가해지는 열과 압력에 의해 활성화됩니다.
  • 신뢰할 수 있는 칩 모듈 본딩
    • PVC, ABS, PET 및 PC 카드에 적합
  • 모든 일반 인플란팅 라인에 대한 작업 용이성
  • 뛰어난 내노화성
  • 고무 함량이 높아 제품수명내내 유연성 제공

Product description

tesa® HAF 8410은 페놀 수지와 니트릴 고무로 된 열활성 양면 황색 점착 필름입니다.

  • 칩 모듈에의 안정적인 점착력
  • PVC, ABS, PET, 폴리카보네이트 카드에 적합
  • 일반적인 삽입 공정에서의 우수한 작업성
  • 뛰어난 내노화성
  • 고무 함량이 높아 제품 전기간에 걸쳐 유연성 유지

Application Fields

tesa® HAF 8410은 스마트 카드에 칩 모듈을 삽입하는 용도로 설계된 제품입니다.금속, 유리, 플라스틱, 목재, 섬유 등 모든 내열성 재료의 부착에도 적합한 제품입니다(클러치 용 마찰 라이너 등).

Product Construction

이형지 종류 글라신지
기재 소재 없음
점착제 종류 니트릴고무 / 페놀수지
총두께 60 µm
컬러 amber

Properties / Performance Values

점착력 (동적 전단) 12 N/mm²

Additional Info

Technical recommendations for Smart Card applications:
tesa HAF® 8410 is not self adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip modules as well as customer requirements.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination step does not affect the shelf life time of the adhesive tape. Pre-laminated belts can be stored over the same period of time as the adhesive tape.
Machine setting:
  • Temperature 120 – 140 °C
  • Pressure 2 – 3 bar
  • Time 2.5 m/min
2. Module embedding:
During module embedding, the pre-laminated modules are cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of implanting line, single-step or multiple-step process are possible. Today, most implanting machines have multiple heat press steps.
Single-step process - machine setting:
  • Temperature¹ 180 – 200 °C
  • Pressure 65 – 75 N/module
  • Time 1.5 s
Multiple-step process - machine setting:
  • Temperature¹ 180 – 200 °C
  • Pressure 65 – 75 N/module
  • Time 2 x 0.7 s / 3 x 0.5 s
¹ Temperature measured inside the heating stamp. Different temperature settings recommended for different card materials:
PVC and ABS: 180 – 190 °C
PET and PC: 190 – 200 °C
Bonding strength values were obtained under standard laboratory conditions. Value is specification limit checked for each production batch (material: etched aluminum test specimen / bonding conditions: Temp. = 120 °C; pressure = 10 bar; time = 8 min). To reach maximum bonding strength, surfaces should be clean and dry.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.

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