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Increased device stability with our structural bonding solutions
Electronic devices are increasingly miniaturized and sophisticated. Complex designs require smaller bonding areas and higher tape performance. tesa® structural bonding solutions meet the most challenging demands of manufacturers and consumers over the life cycle of the devices. They provide high structural bonding performance to a wide variety of substrates with both fast and durable bonds. They withstand the harshest conditions by combining outstanding chemical and aging resistance with excellent sealing properties. The processing of these adhesive systems is simplified due to excellent die-cuttability, immediate handling stability after heat activation, and low oozing.
Our tesa HAF® and tesa® XPU series are thermosetting adhesive systems. An irreversible cross-linking reaction is initiated by heat and pressure starting at temperatures above 110°C.
tesa HAF® is a heat-activated film based on phenolic resin and nitrile rubber. It is activated by heat and pressure starting at temperatures above 120°C, resulting in extremely strong bonds and outstanding reliability.
tesa® Cross-Linkable Polyurethane (XPU) is activated by very low bonding pressure and temperatures from 110°C to 200°C. Our XPU series offer strong and reliable bonding strength – even on combinations of different substrates like plastics and metals.
tesa® LTR is especially recommended for the reliable bonding of temperature-sensitive substrates. The LTR 5848x and 871x series bond extremely well to plastics and leather, while LTR 872x is specifically designed for the bonding of fabrics.
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