Structural Bonding for Increased Device Stability
Increased device stability with our structural bonding solutions: tesa HAF®.
Electronic devices are becoming more and more miniaturised and sophisticated. Complex designs require both smaller bonding areas and higher tape performance. Our tesa HAF® tapes are successfully used in many of these applications and offer not only superior bonding strength and shock resistance but also durability and environmental resistance on a broad variety of substrates. Because of these features, our adhesive tapes meet all the requirements of structural bonding.
- FPC stiffening
- Frame mounting/enclosure assembly
- Magnesium bracket mounting
- tesa reactive HAF®
- tesa anti-shock reactive HAF®
- tesa low-temperature reactive HAF®
- tesa thermoplastic HAF®