Product information

tesa® 70499 Bond & Detach

1000µm Bond & Detach 접착 & 분리

Product description

tesa® 70499 점착제를 늘려 쉽게 제거가 가능한 양면 마운팅 테이프.

tesa® 70499 특성
  • Thickness: 1000µm
  • Very high bonding strength
  • High push out and shock resistance
  • Easy removability by stretching the adhesive
  • Residue free removal even after long bonding time
  • High performance also on LSE substrates

Main applications

  • Battery mounting 배터리 마운팅
  • Permanent mounting of components in electronic devices with the option to remove the parts for repairing or recycling 전자기기의 부품 영구 마운팅 (수리 및 재활용을 위해 부붐 제거 가능 옵션)


Technical properties

점착제 종류


이형지 종류


이형지 색깔



1000 µm

기재 소재




Adhesion properties

Steel점착력 (초기)

29 N/cm

PE점착력 (초기)

19 N/cm

PC점착력 (14일 후)

27 N/cm

알루미늄점착력 (14일 후)

25 N/cm

PC점착력 (초기)

27 N/cm

Magnesium 면의 점착력 (초기)

23 N/cm

유리점착력 (14일 후)

29 N/cm

PE점착력 (14일 후)

19 N/cm

유리점착력 (초기)

29 N/cm

알루미늄점착력 (초기)

24 N/cm

Steel점착력 (14일 후)

29 N/cm

Magnesium 면의 점착력 (14일 후)

23 N/cm

Rating properties

14일 후 제거성 (23℃)


정적 전단응력 (23°C)


장기 내열성

60 °C

정적 전단응력 (40°C)


단기 내열성

90 °C

tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.

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