8871 [Master PI]
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High performance thermosetting tape for partial reinforcement of Flexible Printed Circuits (FPC)
tesa® 8871 is a heat curing adhesive tape suitable for partially reinforcing FPC. This transparent double-sided tape has no backing. It is protected by a transparent PET cover liner and a white PET base liner.
tesa® 8871 is free of halogen and compliant with current ROHS standards.
tesa® 8871 is especially suitable for Quick Press processes which are followed by an additional oven curing step. For easy positioning tesa® 8871 offers slight tack. Excellent wetting behaviour minimizes the risk of bubble formation.
Key features of tesa® 8871:
tesa® 8871 is especially recommended for stiffening of FPC where partial reinforcement is necessary.
elastomer modified heat curable epoxy
10 10^12 Ω
2 10^14 Ωm
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.