Share this page
More privacy
Currently no data is transferred to social networks. This happens first when you click on the referring icon. Then a pop-up window opens. Only then, and not before, a data connection will be built up.
tesa ® XPU 58708
200μm x-linkable polyurethane black HAF mounting tape
- Extremely high bonding performance and reliability, even on thin design gaps
- Excellent shock resistance
- Extremely low oozing ratio
- tesa ® XPU 58708 is free of halogen according to IEC 61249-2-21 and compliant with current RoHS directive.
- At room temperature tesa ® XPU 58708 is not tacky.
Product description
200μm x-linkable polyurethane black HAF
mounting tape
Long description
tesa ® XPU 58708 is a reactive mounting tape offering high bonding strength and elasticity after curing. This black double-sided tape has no backing. It is protected by a PE-coated paper liner.
It is activated by heat and pressure applied during the assembly process.
Special features:
Black design
Long description
tesa ® XPU 58708 is a reactive mounting tape offering high bonding strength and elasticity after curing. This black double-sided tape has no backing. It is protected by a PE-coated paper liner.
It is activated by heat and pressure applied during the assembly process.
Special features:
Black design
Application Fields
tesa ® XPU 58708 is especially recommended for structural bonding of various substrates inside electronic devices:
• Bonding of plastics
• Bonding of metals
• Bonding of electronic components
• Bonding of plastics
• Bonding of metals
• Bonding of electronic components
Product Construction
| Type of adhesive | crosslinkable polyurethane |
| Type of liner | PE-coated paper |
| Total thickness | 200 |
| Backing material | none |
| Color | black |
Properties / Performance Values
| Bonding strength (push-out) | 4 |
Additional Info
Technical recommendations:
tesa® XPU 58708 is not self-adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for bond line parameters to start with.
• Pre-lamination
During pre-lamination, laminate the adhesive tape onto the first component.
Setting:
Temperature¹ 55-65 °C
Pressure² 3 bar
Time 5 – 20 s
Short-time exposure to 65 °C bond line temperature during pre-lamination does not affect the final bonding potential.
2. Bonding
Remove the liner from tape after the pre-lamination step.Position the second component.
Apply temperature and pressure for the bonding time to reach sufficient bonding strength.
2.1. PC/PC:Setting:
• Temperature¹ 80 – 140 °C
• Pressure² 5 bar
• Time 10 – 120 s
2.2. AL/PC:Setting:
• Temperature¹ 110 – 190 °C
• Pressure² 5 bar
• Time 20 – 120 s
Short cycle times can be achieved at high bond line temperatures. For activation at low temperatures, increase the heat-press time. To reach maximum bonding strength, surfaces should be clean and dry. Allow at least 1-2 hours dwell-time after bonding before performance testing. Final bonding strength will be reached after 24 hours. Bonding strength values were obtained under standard laboratory conditions. PC/PC: bonding conditions: temperature = 110 °C
(120 °C jig); pressure = 5 bar; time = 60 sec Storage: tesa® recommends storage in original packaging in cool and dry conditions.
• ‘Pre-lamination’ and ‘Bonding’ temperature refer to the data that is measured in the bond line.
• ‘Pre-lamination’ and ‘Bonding’ pressure refer to the force that is transferred from jig surface directly to the bonding area.
tesa® XPU 58708 is not self-adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for bond line parameters to start with.
• Pre-lamination
During pre-lamination, laminate the adhesive tape onto the first component.
Setting:
Temperature¹ 55-65 °C
Pressure² 3 bar
Time 5 – 20 s
Short-time exposure to 65 °C bond line temperature during pre-lamination does not affect the final bonding potential.
2. Bonding
Remove the liner from tape after the pre-lamination step.Position the second component.
Apply temperature and pressure for the bonding time to reach sufficient bonding strength.
2.1. PC/PC:Setting:
• Temperature¹ 80 – 140 °C
• Pressure² 5 bar
• Time 10 – 120 s
2.2. AL/PC:Setting:
• Temperature¹ 110 – 190 °C
• Pressure² 5 bar
• Time 20 – 120 s
Short cycle times can be achieved at high bond line temperatures. For activation at low temperatures, increase the heat-press time. To reach maximum bonding strength, surfaces should be clean and dry. Allow at least 1-2 hours dwell-time after bonding before performance testing. Final bonding strength will be reached after 24 hours. Bonding strength values were obtained under standard laboratory conditions. PC/PC: bonding conditions: temperature = 110 °C
(120 °C jig); pressure = 5 bar; time = 60 sec Storage: tesa® recommends storage in original packaging in cool and dry conditions.
• ‘Pre-lamination’ and ‘Bonding’ temperature refer to the data that is measured in the bond line.
• ‘Pre-lamination’ and ‘Bonding’ pressure refer to the force that is transferred from jig surface directly to the bonding area.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
Downloads
