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tesa® LTC 58664

100μm Low Temperature Cross-linkable reactive structural bonding film

  • Extremely high bonding performance and reliability, even on thin design gaps
  • Activated at low temperature and pressure
  • Excellent shock resistance
  • Chemical resistant
  • Strong reliability performance especially on metals
  • Very low oozing ratio
  • At room temperature tesa® LTC 58664 is not tacky.
  • tesa® LTC 58664 is free of halogen and compliant with current RoHS directive.

Product description

tesa® Low Temperature Cross-linkable (LTC) 58664 is a reactive structural bonding film activated at moderate temperatures. This black film has no backing. It is protected by a PE coated paper liner.

It is activated by moderate heat and pressure applied during the assembly process.

Application Fields

tesa® LTC is especially recommended for structural bonding of various substrates inside electronic devices:
  • Structural bonding of metals
  • Mounting of sensitive electronic components

Product Construction

Type of adhesive crosslinkable polyurethane
Type of liner PE-coated paper
Total thickness 100 µm
Backing material none
Color black

Properties / Performance Values

Bonding strength (push-out) 4 N/mm²

Additional Info

Technical recommendations:
tesa® LTC is not self-adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for bond line parameters to start with.
1) Pre-lamination
During pre-lamination, laminate the adhesive film onto the first component. Setting:
  • Temperature¹ 50-60 °C
  • Pressure² 1-5 bar
  • Time 5 – 20 s


Short-time exposure to 60°C bond line temperature during pre-lamination does not impact final bonding potential.
2) Bonding
Remove the liner from the film after the pre-lamination step. Position the second component. Apply temperature and pressure for the bonding time to reach sufficient bonding strength. Setting:
  • Temperature¹ 75 – 110 °C
  • Pressure² 3 – 10 bar
  • Time 10 – 480 s
Temperature, pressure and time will depend upon the type and thickness of the substrates. Generally, thicker substrates or lower bonding temperatures will require longer bonding times.
Short cycle times can be achieved at 110 °C bond line temperature. For activation at lower temperatures, increase the heat-press time or combine a short heat-press step with oven curing.
Bonding strength values were obtained under standard laboratory conditions (Material: PC/PC; bonding conditions: temperature = 90 °C; pressure = 10 bar; time = 300 sec).
To reach maximum bonding strength, surfaces should be clean and dry. Allow at least 1-2 hours dwell-time after bonding before performance testing. Final bonding strength will be reached after 24 hours.
Storage
  • tesa recommends storage in original packaging in cool and dry conditions.
  • tesa® LTC should not be exposed to more than 35°C at any time before bonding (during transport, storage and converting). Long term storage should remain below 25°C.
  • The shelf life is 6 months after production. For the actual shelf life please refer to the best before date on the label in the log roll core.
  • More details are available in our transportation guideline.


¹ ‘Pre-lamination’ and ‘Bonding’ temperature refer to the data that is measured in the bond line. ² ‘Pre-lamination’ and ‘Bonding’ pressure refer to the force that is transferred from jig surface directly to the bonding area.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.