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tesa HAF® 8460 is a heat activated, double-sided translucent adhesive film based on thermoplastic copolyamide.
1 Reliable chip module bonding
1 Suitable for PVC, ABS and PC cards
1 Good workability on all common implanting lines
1 Good ageing resistance
1 Invisible on assembled card
tesa HAF® 8460 is especially designed for the embedding of chip-modules into smart cards.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
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