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tesa HAF® 8412 is an amber heat-activated adhesive film based on reactive phenolic resin and nitrile rubber containing conductive particles.
1 Reliable chip bonding and electrical connectivity in one step
1 Good workability on all common implanting lines
1 Suitable for PVC, ABS and PC cards (DI)
1 Good ageing resistance
Thickness: 45 µm (mean value of particle size)
tesa HAF® 8412 is designed for the embedding of chip-modules into dual interface smart cards for contact less and contact based applications.
nitrile rubber / phenolic resin
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
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