![[Master PI]](/en/files/images/201811/32/58434-master-pi,152921_fixedwidth_1.jpg "58434 [Master PI]")
58434 [Master PI]
[Master PI]
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Product description
tesa HAF® 58434 is a heat activated double-sided black adhesive film based on reactive phenolic resin and nitrile rubber.
Special Features:
- Reliable chip module bonding
- Suitable for PVC, ABS, PET, and PC cards
- Good workability on all common implanting lines
- Outstanding ageing resistance
- Lifelong flexibility due to high rubber content
- Black adhesive
Main applications
tesa HAF® 58434 is especially designed for the embedding of chip-modules into smart cards.
Technical properties
Backing material
none
Color
black
Total thickness
50 µm
Type of adhesive
nitrile rubber / phenolic resin
Type of liner
glassine
Bonding strength
12 N/mm²
Shelf life time < 5°C
18 months
Shelf life time < 15°C
15 months
Shelf life time < 25°C
12 months
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
