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Product description
tesa HAF® 58434 is a heat activated double-sided black adhesive film based on reactive phenolic resin and nitrile rubber.Special Features:
- Reliable chip module bonding
- Suitable for PVC, ABS, PET, and PC cards
- Good workability on all common implanting lines
- Outstanding ageing resistance
- Lifelong flexibility due to high rubber content
- Black adhesive
Main applications
tesa HAF® 58434 is especially designed for the embedding of chip-modules into smart cards.Technical properties
Shelf life time < 25°C
12 months
Bonding strength
12 N/mm²
Type of adhesive
nitrile rubber / phenolic resin
Shelf life time < 15°C
15 months
Type of liner
glassine
Shelf life time < 5°C
18 months
Total thickness
50 µm
Backing material
none
Color
black
Additional Info
Technical recommendations for Smart Card applications:tesa HAF® 58434 is not self adhesive. It is activated by heat and pressure over a certain interval. The following values are recommendations for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip modules as well as customer requirements.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination step does not affect the shelf life time of the adhesive tape. Pre-laminated belts can be stored over the same period of time as the adhesive tape.
Machine setting:
- Temperature 120 – 140 °C
- Pressure 2 – 3 bar
- Time 2.5 m/min
2. Module embedding:
During module embedding, the pre-laminated modules are cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of implanting line, single-step or multiple-step process are possible. Today, most implanting machines have multiple heat press steps.
Single-step process - machine setting:
- Temperature¹ 180 – 200 °C
- Pressure 65 – 75 N/module
- Time 1.5 s
Multiple-step process - machine setting:
- Temperature¹ 180 – 200 °C
- Pressure 65 – 75 N/module
- Time 2 x 0.7 s / 3 x 0.5 s
¹ Temperature measured inside the heating stamp. Different temperature settings recommended for different card materials:
PVC and ABS: 180 – 190 °C
PET and PC: 190 – 200 °C
Bonding strength values were obtained under standard laboratory conditions. Value is specification limit checked for each production batch (material: etched aluminum test specimen / bonding conditions: Temp. = 120 °C; pressure = 10 bar; time = 8 min).
To reach maximum bonding strength, surfaces should be clean and dry. Storage condition according to tesa HAF® shelf life concept.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
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