tesa HAF® 58442

40µm black HAF mounting tape

Product description

tesa HAF® 58442 is a heat activated, double-sided black adhesive film based on thermoplastic copolyamide.
Special Features:
1 Reliable chip module bonding
1 Suitable for PVC, ABS and PC cards
1 Good workability on all common implanting lines
1 Good ageing resistance

Main applications

tesa HAF® 58442 is especially designed for the embedding of chip-modules into smart cards.

Technical properties

Shelf life time < 25°C

12 months

Bonding strength

12 N/mm²

Type of adhesive


Shelf life time < 15°C

15 months

Type of liner


Shelf life time < 5°C

18 months

Total thickness

40 µm

Backing material




Additional Info

Technical Recommendations:
The following values are recommendation for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.

1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. This step can be performed inline or offline. The pre-lamination step does not effect the shelf life time of the adhesive tape.

Machine setting:
  • Temperature 130 - 140 °C
  • Pressure 2 - 3 bar
  • Time 2.5 m/min

2. Module Embedding:
During module embedding, the pre-laminated modules are die cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. For this step, the exact handling depends on the type of the implanting line used. Single step and multiple step can be used. Today, multiple step is common:

Single step process - Machine setting :
  • Temperature¹ 180 – 220 °C
  • Pressure 65 - 75 N/module
  • Time 1.5 s

Multiple step process (2 or more heating stamps) - Machine setting:
  • Temperature¹ 180 – 220 °C
  • Pressure 65 - 75 N/module
  • Time 2 x 0,7 s. /3 x 0.5 s

¹ Temperature as measured inside the heating stamp. Different temperature settings are recommended for different card material:
1 PVC 180 - 190 °C
1 ABS 180 - 190 °C
1 PC 200 - 220°C

For applicants other than chip module implanting, different machine parameters should be used.
Bonding strength values were obtained under standard laboratory conditions. Value is guaranteed clearance limit checked with each production batch (Material: Etched aluminium test specimen / Bonding conditions: Temp. = 120 °C; p = 10 bar; t = 8 min)

Storage conditions according to tesa HAF® shelf life concept.

tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.

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