Product information

tesa® HAF 58434

50µm black reactive HAF mounting tape

Product description

tesa® HAF 58434 is a heat activated double-sided black adhesive film based on reactive phenolic resin and nitrile rubber.

Special Features:
1 Reliable chip module bonding
1 Suitable for PVC, ABS, PET, and PC cards
1 Good workability on all common implanting lines
1 Outstanding ageing resistance
1 Lifelong flexibility due to high rubber content
1 Black adhesive

Main applications

tesa® HAF 58434 is especially designed for the embedding of chip-modules into smart cards.

Technical properties

Shelf life time < 25°C

12 months

Bonding strength

12 N/mm²

Type of adhesive

nitrile rubber / phenolic resin

Shelf life time < 15°C

15 months

Type of liner


Shelf life time < 5°C

18 months

Total thickness

50 µm

Backing material




Additional Info

Technical recommendations for smart card applications:
The following values are recommendations for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.
1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. The pre-lamination step does not effect the shelf life time of the adhesive tape. Pre-laminated module belts can be stored over the same period of time as the adhesive tape.
Machine setting:
  • Temperature 120 – 140 °C
  • Pressure 2 – 3 bar
  • Time 1.5 – 2.5 m/min.
2. Module Embedding:
During module embedding, the pre-laminated modules are die cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. Depending on the type of implanting line, single step or multiple step process can be used. Today, most implanting machines have multiple heat press steps.
Single step process - Machine setting:
  • Temperature¹ 180 – 220 °C
  • Pressure 65 N/module
  • Time 1.5 s.
Multiple step process (2 or more heating stamps) - Machine setting:
  • Temperature¹ 180 – 220 °C
  • Pressure 65 N/module
  • Time 2 x 0,7 s. / 3 x 0.5 s

¹ Temperature as measured inside the heating stamp. Different temperature settings are recommended for different card material:
PVC 180 – 190 ° C
ABS 180 – 190 ° C
PET 190 – 200 ° C
PC 200 – 220 °C

Bonding strength values were obtained under standard laboratory conditions. Value is guaranteed clearance limit checked with each production batch (Material: Etched aluminium test specimen / Bonding conditions: Temp. = 120 °C; p = 10 bar; t = 8 min)

To reach maximum bonding strength surfaces should be clean and dry. Storage conditions according to tesa® HAF shelf life concept.

tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.

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