8440 HS

40µm 반투명 HAF 마운팅 테이프


제품 기능
  • 안정적인 칩 모듈에의 점착력
  • PVC, ABS, 폴리카보네이트 카드에 적합
  • 일반적인 삽입 공정에서의 우수한 작업성
모든 제품 기능
Product description

tesa® HAF 8440은 열가소성 코폴리이미드가 들어간 열활성 양면 반투명 점착 필름입니다.

특성:

  • 안정적인 칩 모듈에의 점착력
  • PVC, ABS, 폴리카보네이트 카드에 적합
  • 일반적인 삽입 공정에서의 우수한 작업성
  • 우수한 내후성
  • 조립된 카드에서는 보이지 않음


제품 세부 사항 및 사양

제품 기능

  • 안정적인 칩 모듈에의 점착력
  • PVC, ABS, 폴리카보네이트 카드에 적합
  • 일반적인 삽입 공정에서의 우수한 작업성
  • 우수한 내후성
  • 조립된 카드에서는 보이지 않음

Application Fields

tesa® HAF 8440은 스마트 카드에 칩 모듈을 삽입하는 용도로 설계된 제품입니다.
Technical Recommendations:
The following values are recommendation for machine parameters to start with. Please note that optimum parameters strongly depend on the type of machine, particular materials for card bodies and chip-modules as well as customer requirements.

1. Pre-lamination:
During pre-lamination, the adhesive tape is laminated onto the module belt. This step can be performed inline or offline. The pre-lamination step does not effect the shelf life time of the adhesive tape.

Machine setting:
  • Temperature 130 - 140 °C
  • Pressure 2 - 3 bar
  • Time 2.5 m/min

2. Module Embedding:
During module embedding, the pre-laminated modules are die cut from the module belt, positioned into the card cavity and permanently bonded to the card body by heat and pressure. For this step, the exact handling depends on the type of the implanting line used. Single step and multiple step can be used. Today, multiple step is common:

Single step process - Machine setting :
  • Temperature¹ 180 – 220 °C
  • Pressure 65 - 75 N/module
  • Time 1.5 s

Multiple step process (2 or more heating stamps) - Machine setting:
  • Temperature¹ 180 – 220 °C
  • Pressure 65 - 75 N/module
  • Time 2 x 0,7 s. /3 x 0.5 s

¹ Temperature as measured inside the heating stamp. Different temperature settings are recommended for different card material:

1 PVC 180 - 190 °C
1 ABS 180 - 190 °C
1 PC 200 - 220°C
For applicants other than chip module implanting, different machine parameters should be used.
Bonding strength values were obtained under standard laboratory conditions. Value is guaranteed clearance limit checked with each production batch (Material: Etched aluminium test specimen / Bonding conditions: Temp. = 120 °C; p = 10 bar; t = 8 min)

Storage conditions according to tesa HAF® shelf life concept.
tesa® products prove their impressive quality day in, day out in demanding conditions and are regularly subjected to strict controls. All technical information and data above mentioned are provided to the best of our knowledge on the basis of our practical experience. They shall be considered as average values and are not appropriate for a specification. Therefore tesa SE can make no warranties, expressed or implied, including, but not limited to any implied warranty of merchantability or fitness for a particular purpose. The user is responsible for determining whether the tesa® product is fit for a particular purpose and suitable for the user’s method of application. If you are in any doubt, our technical staff will be glad to support you.
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