Smart cards
Chip Bonding

Chip Bonding

Embedding of modules in smart cards – discover our adhesive solutions for reliable chip bonding.



Contact Cards

Contact card
Contact card

Permanent bonding of a chip module into the cavity of substrates is crucial for all smart card manufacturers to ensure the cards function properly in daily applications. For contact card assembly processes, we offer tesa HAF®, a complete range of Heat-Activated Films with a high level of bonding strength to a variety of card substrates.

Advantages of using tesa® HAF products:

  • Long-term reliable chip bonding
  • Suitable for PVC, ABS, PET, and PC substrates
  • Good workability on all common assembly lines
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Dual Interface Cards

Dual interface card
Dual interface card

The market for Dual Interface cards (DI cards) is booming, especially for payment and identity cards. DI cards require a reliable connection between the antenna and the chip module. For DI card assembly processes, we offer tesa® ACF 8414, an anisotropic conductive hotmelt film that can be adapted to common assembly lines without investments. Mechanically embedding the module and electrically contacting the antenna are now performed in a single step, which is as easy as the assembly of contact cards.

Advantages of using tesa® ACF 8414:

  • Long-term reliable chip bonding and electrical connection in one step
  • Suitable for PVC, ABS, PET, and PC substrates
  • Good workability on all common assembly lines (no investment in machines dedicated to DI cards)
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Show filters

tesa HAF® 8402

Specifications
none
nitrile rubber / phenolic resin
125 µm

tesa HAF® 8410

Specifications
none
nitrile rubber / phenolic resin
60 µm

tesa HAF® 8414

Specifications
none
copolyamide

tesa® HAF 8430

Specifications
none
nitrile rubber / phenolic resin
45 µm

tesa® HAF 8440

Specifications
none
copolyamide
40 µm

tesa HAF® 58434

Specifications
none
nitrile rubber / phenolic resin
50 µm

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